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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TS991SNL500T3
Chip Quik Inc.
Product No:
TS991SNL500T3
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
SOLDER PASTE THERMALLY STABLE NC
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Please send RFQ , we will respond immediately.
TS991SNL500T3 - Product Information
Parameter Info
User Guide
| Mfr | Chip Quik Inc. |
| Form | Jar, 17.64 oz (500g) |
| Type | Solder Paste |
| Series | CHIPQUIK® |
| Package | Bulk |
| Process | Lead Free |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 3 |
| Shelf Life | 12 Months |
| Wire Gauge | - |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423°F (217°C) |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Base Product Number | TS991S |
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