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HSS26-B20-P38

CUI Devices

Product No:

HSS26-B20-P38

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218/TO-2

Quantity:

Delivery:

Payment:

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HSS26-B20-P38 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Fins
Width 1.378" (35.00mm)
Length 2.000" (50.80mm)
Series HSS
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.335" (8.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Thermal Resistance @ Natural 16.66°C/W
Power Dissipation @ Temperature Rise 4.5W @ 75°C
Thermal Resistance @ Forced Air Flow 9.20°C/W @ 200 LFM