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HSS03-B20-P318

CUI Devices

Product No:

HSS03-B20-P318

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 41.

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

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HSS03-B20-P318 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 1.300" (33.02mm)
Length 1.640" (41.66mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.470" (11.94mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Thermal Resistance @ Natural 13.67°C/W
Power Dissipation @ Temperature Rise 5.5W @ 75°C
Thermal Resistance @ Forced Air Flow 5.60°C/W @ 200 LFM