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HSS02-B20-P318

CUI Devices

Product No:

HSS02-B20-P318

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 23.

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

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HSS02-B20-P318 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 0.930" (23.62mm)
Length 1.900" (48.26mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.950" (24.13mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Thermal Resistance @ Natural 10.90°C/W
Power Dissipation @ Temperature Rise 6.9W @ 75°C
Thermal Resistance @ Forced Air Flow 4.80°C/W @ 200 LFM