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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
HSE08-505028
CUI Devices
Product No:
HSE08-505028
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Please send RFQ , we will respond immediately.
HSE08-505028 - Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Board Level |
| Shape | Rectangular, Angled Fins |
| Width | 1.102" (28.00mm) |
| Length | 1.969" (50.00mm) |
| Series | HSE |
| Package | Bag |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 1.969" (50.00mm) |
| Package Cooled | TO-218, TO-220 |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Clip |
| Thermal Resistance @ Natural | 7.13°C/W |
| Power Dissipation @ Temperature Rise | 10.53W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.70°C/W @ 200 LFM |
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