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HSE-B254-04H

CUI Devices

Product No:

HSE-B254-04H

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-220/TO-

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

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HSE-B254-04H - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Fins
Width 0.650" (16.50mm)
Length 1.000" (25.40mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.630" (16.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B254
Thermal Resistance @ Natural 15.96°C/W
Power Dissipation @ Temperature Rise 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow 4.93°C/W @ 200 LFM