Home / Heat Sinks / HSB28-606022

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HSB28-606022

CUI Devices

Product No:

HSB28-606022

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 60 X 60 X 22 MM,

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Certif07 Certif02 Certif04 Certif03 Certif10

HSB28-606022 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 2.362" (60.00mm)
Length 2.362" (60.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.866" (22.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Push Pin
Thermal Resistance @ Natural 4.74°C/W
Power Dissipation @ Temperature Rise 15.83W @ 75°C
Thermal Resistance @ Forced Air Flow 1.40°C/W @ 200 LFM