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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
HSB19-272718
CUI Devices
Product No:
HSB19-272718
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 27 X 27 X 18 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Please send RFQ , we will respond immediately.
HSB19-272718 - Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.063" (27.00mm) |
| Length | 1.063" (27.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.709" (18.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 11.11°C/W |
| Power Dissipation @ Temperature Rise | 6.8W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM |
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