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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
HSB07-202009
CUI Devices
Product No:
HSB07-202009
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 20 X 20 X 9 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Please send RFQ , we will respond immediately.
HSB07-202009 - Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.787" (20.00mm) |
| Length | 0.787" (20.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.354" (9.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 24.08°C/W |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 8.60°C/W @ 200 LFM |
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