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HSB01-080808

CUI Devices

Product No:

HSB01-080808

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Quantity:

Delivery:

Payment:

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HSB01-080808 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.335" (8.50mm)
Length 0.335" (8.50mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.315" (8.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive (Not Included)
Thermal Resistance @ Natural 39.10°C/W
Power Dissipation @ Temperature Rise 1.9W @ 75°C
Thermal Resistance @ Forced Air Flow 16.00°C/W @ 200 LFM