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EXB-SN96.5AG3.0CU0.5-0.5LB

Chip Quik Inc.

Product No:

EXB-SN96.5AG3.0CU0.5-0.5LB

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Datasheet:

Description:

SOLDER BAR SN96.5/AG3.0/CU0.5 0.

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

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EXB-SN96.5AG3.0CU0.5-0.5LB - Product Information

Parameter Info

User Guide

Mfr Chip Quik Inc.
Form Bar, 0.5 lb (227g)
Type Bar Solder
Series Super Low Dross™
Package Bulk
Process Leaded
Diameter -
Flux Type -
Shelf Life -
Wire Gauge -
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point 423 ~ 428°F (217 ~ 220°C)
Product Status Active
Shelf Life Start -
Base Product Number EXB-SN96
Storage/Refrigeration Temperature -