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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
BDN11-3CB/A01
CTS Thermal Management Products
Product No:
BDN11-3CB/A01
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEATSINK CPU W/ADHESIVE 1.11"SQ
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Please send RFQ , we will respond immediately.
BDN11-3CB/A01 - Product Information
Parameter Info
User Guide
| Mfr | CTS Thermal Management Products |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.110" (28.19mm) |
| Length | 1.110" (28.19mm) |
| Series | BDN |
| Package | Box |
| Diameter | - |
| Material | Aluminum |
| Fin Height | 0.355" (9.02mm) |
| Shelf Life | 24 Months |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | BDN11 |
| Thermal Resistance @ Natural | 20.90°C/W |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 7.20°C/W @ 400 LFM |
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