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APF30-30-13CB

CTS Thermal Management Products

Product No:

APF30-30-13CB

Package:

-

Batch:

-

Datasheet:

Description:

HEATSINK LOW-PROFILE FORGED

Quantity:

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In Stock : Please Inquiry

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APF30-30-13CB - Product Information

Parameter Info

User Guide

Mfr CTS Thermal Management Products
Type Top Mount
Shape Square, Fins
Width 1.181" (30.00mm)
Length 1.181" (30.00mm)
Series APF
Package Box
Diameter -
Material Aluminum
Fin Height 0.500" (12.70mm)
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Product Status Active
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Not Included)
Base Product Number APF30
Thermal Resistance @ Natural -
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 2.50°C/W @ 200 LFM