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HSS-C2540-SMT-TR

CUI Devices

Product No:

HSS-C2540-SMT-TR

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK TO-263 COPPER

Quantity:

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HSS-C2540-SMT-TR - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 1.000" (25.40mm)
Length 0.763" (19.38mm)
Series HSS
Package Tape & Reel (TR)
Diameter -
Material Copper
Fin Height 0.450" (11.43mm)
Package Cooled TO-263 (D²Pak)
Product Status Active
Material Finish Tin
Attachment Method -
Base Product Number HSS-C2540
Thermal Resistance @ Natural 21.90°C/W
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow 5.50°C/W @ 200 LFM