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HSE05-171933

CUI Devices

Product No:

HSE05-171933

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

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HSE05-171933 - Product Information

Parameter Info

User Guide

Mfr CUI Devices
Type Board Level
Shape Rectangular, Angled Fins
Width 0.669" (17.00mm)
Length 0.764" (19.40mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 1.280" (32.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Thermal Resistance @ Natural 18.83°C/W
Power Dissipation @ Temperature Rise 3.98W @ 75°C
Thermal Resistance @ Forced Air Flow 6.90°C/W @ 200 LFM